IC (Integrated Circuit) is among the most important electronic components, due to complex functions and uses involved, there are several types of ICs from Veswin Electronics. In order to facilitate the management, IC chips were understood to be various standard packages.

IC packaging indicates the dimension and form of a chip. Chips with similar electronic parameters could have different package types. IC package types mostly are divided into traditional DIP dual-in-line and SMD chip package, these are soldered by ways (Wave soldering & Reflow soldering).

History of Integrated Circuits

This technology was invented that year of 1950 the by Jack Kilby of Texas Instruments USA and Robert Noyce of Fairchild Semiconductor USA. The first costumer to the new invention was the US Air Force. In the year 2000 Jack Kilby won the Nobel Prize in Physics for miniaturized electronic circuits.

One and a half years after Kilby demonstrated his IC design, Robert Noyce of Fairchild Semiconductor Limited invented his own integrated circuit. His model solved many practical problems which Kilby’s device had. It was derived from silicon when Kilby’s was consisting of germanium. Jack Kilby and Robert Noyce both received US patents because of their part of focus on integrated circuits. After a few years of legal issues both companies wisely chose to cross license their technology and made a huge global market.

IC Package Types

The packages are classified into two kinds on such basis as how they can be mounted on a circuit board

Through-Hole Mount Packages

They are made in a way that the lead pins are stuck through one for reds of the board and smoldered on the other half. They are bigger in dimensions as compared to the other kind. These are majorly employed in electronic equipment to pay for the board space and price limitations. Dual inline packages are one with the examples of through-hole mount packages.

Surface Mount Packaging

Surface mount packaging follows the technology of mounting or placing the constituents directly on the printed circuit board surface. Although this method of fabrication helps do things quickly, additionally, it increases the odds of defects. This is because on the miniaturization of components as well as because these are mounted extremely near each other. This, consequently, ends in making it essential to detect the failure from the entire process. Again, Surface mount packaging also uses ceramic or plastic molding. You can check more information at https://www.veswin.com/category-Memory.html .